An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem

Yu Chen Hu, Yu Chieh Huang, Po Tsang Huang, Shang Lin Wu, Hsiao Chun Chang, Yu Tao Yang, Yan Huei You, Jr Ming Chen, Yan Yu Huang, Yen Han Lin, Jeng Ren Duann, Tzai Wen Chiu, Wei Hwang, Ching Te Chuang, Jin Chern Chiou, Kuan Neng Chen

Research output: Contribution to journal › Article › peer-review

16 Scopus citations

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Material Science

Engineering