An Advanced 2.5-D Heterogeneous Integration Packaging for High-Density Neural Sensing Microsystem

Yu Chen Hu, Yu Chieh Huang, Po Tsang Huang, Shang Lin Wu, Hsiao Chun Chang, Yu Tao Yang, Yan Huei You, Jr Ming Chen, Yan Yu Huang, Yen Han Lin, Jeng Ren Duann, Tzai Wen Chiu, Wei Hwang, Ching Te Chuang, Jin Chern Chiou, Kuan Neng Chen

Research output: Contribution to journalArticlepeer-review

14 Scopus citations


In the traditional neural sensing microstructure, the limited metal line pitch and the metal layer numbers restrict the neural signal routing ability from electrodes to circuit chips. Miniature packaging and excessive noise interference bottlenecks are some of the challenges faced by the electrodes and circuit chips integration with traditional wire bonding. This paper proposes a 2.5-D heterogeneous integration neural sensing microsystem based on the silicon substrate to overcome these issues. With standard semiconductor and 3-D integration processes, high-channel-density (256 channels at 25 mm2) neural sensing microsystem is achieved. Through silicon via provides the shortest vertical interconnection and dramatically minimizes the packaging. Furthermore, the interposer can carry multiple chips to enhance the function of the biosensor. Electrical characteristics and reliability examinations reveal its high quality and great performance as compared to traditional approaches. This novel highly integrated neural sensing microsystem is expected to contribute to the biomedical field for exploring and solving unknown biological mysteries.

Original languageEnglish
Article number7847332
Pages (from-to)1666-1673
Number of pages8
JournalIEEE Transactions on Electron Devices
Issue number4
StatePublished - Apr 2017


  • 2.5-D heterogeneous integration
  • Biosensor
  • MEMS
  • Neural sensing microsystem
  • Through silicon via (TSV)
  • μ-probes


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