A study of large area die bonding materials and their corresponding mechanical and thermal properties

Te Yuan Chung; Jian Hong Jhang; Jing Sian Chen; Yi Chien Lo; Gwo Herng Ho; Mount Learn Wu; Ching Cherng Sun

doi:10.1016/j.microrel.2011.03.029

A study of large area die bonding materials and their corresponding mechanical and thermal properties

Te Yuan Chung, Jian Hong Jhang, Jing Sian Chen, Yi Chien Lo, Gwo Herng Ho, Mount Learn Wu, Ching Cherng Sun

Research output: Contribution to journal › Article › peer-review

27 Scopus citations

Abstract

We tested the ability of Au/Sn eutectic, silver paste, and solder paste to bond to a large area as well as the bonding of a high power LED die to a highly conductive submount. The samples ran through several tests including ultrasound image, shear force, and thermal resistance measurement. Finite element analysis (FEA) models were built for comparison and analysis. Au/Sn bonding shows the best thermal and mechanical properties. Silver paste shows lower contact thermal resistance compared with solder paste. Although the thickness of the silver paste bonding layer is greater than the solder paste bonding layer, the average total thermal resistance is noticeably lower than the solder paste bonded samples.

Original language	English
Pages (from-to)	872-877
Number of pages	6
Journal	Microelectronics Reliability
Volume	52
Issue number	5
DOIs	https://doi.org/10.1016/j.microrel.2011.03.029
State	Published - May 2012

Access to Document

10.1016/j.microrel.2011.03.029

Cite this

@article{faf18666ea5b4019bd955f8ad6588592,

title = "A study of large area die bonding materials and their corresponding mechanical and thermal properties",

abstract = "We tested the ability of Au/Sn eutectic, silver paste, and solder paste to bond to a large area as well as the bonding of a high power LED die to a highly conductive submount. The samples ran through several tests including ultrasound image, shear force, and thermal resistance measurement. Finite element analysis (FEA) models were built for comparison and analysis. Au/Sn bonding shows the best thermal and mechanical properties. Silver paste shows lower contact thermal resistance compared with solder paste. Although the thickness of the silver paste bonding layer is greater than the solder paste bonding layer, the average total thermal resistance is noticeably lower than the solder paste bonded samples.",

author = "Chung, {Te Yuan} and Jhang, {Jian Hong} and Chen, {Jing Sian} and Lo, {Yi Chien} and Ho, {Gwo Herng} and Wu, {Mount Learn} and Sun, {Ching Cherng}",

note = "Funding Information: This research was funded by Contracts NSC-99-2623-E-008-004-ET, 100-ET-E-008-004-ET, 100-3113-E-008-001 and NSC 98-2221-E-008-014 from the National Science Council of Taiwan. ",

year = "2012",

month = may,

doi = "10.1016/j.microrel.2011.03.029",

language = "???core.languages.en_GB???",

volume = "52",

pages = "872--877",

journal = "Microelectronics Reliability",

issn = "0026-2714",

number = "5",

}

TY - JOUR

T1 - A study of large area die bonding materials and their corresponding mechanical and thermal properties

AU - Chung, Te Yuan

AU - Jhang, Jian Hong

AU - Chen, Jing Sian

AU - Lo, Yi Chien

AU - Ho, Gwo Herng

AU - Wu, Mount Learn

AU - Sun, Ching Cherng

N1 - Funding Information: This research was funded by Contracts NSC-99-2623-E-008-004-ET, 100-ET-E-008-004-ET, 100-3113-E-008-001 and NSC 98-2221-E-008-014 from the National Science Council of Taiwan.

PY - 2012/5

Y1 - 2012/5

N2 - We tested the ability of Au/Sn eutectic, silver paste, and solder paste to bond to a large area as well as the bonding of a high power LED die to a highly conductive submount. The samples ran through several tests including ultrasound image, shear force, and thermal resistance measurement. Finite element analysis (FEA) models were built for comparison and analysis. Au/Sn bonding shows the best thermal and mechanical properties. Silver paste shows lower contact thermal resistance compared with solder paste. Although the thickness of the silver paste bonding layer is greater than the solder paste bonding layer, the average total thermal resistance is noticeably lower than the solder paste bonded samples.

AB - We tested the ability of Au/Sn eutectic, silver paste, and solder paste to bond to a large area as well as the bonding of a high power LED die to a highly conductive submount. The samples ran through several tests including ultrasound image, shear force, and thermal resistance measurement. Finite element analysis (FEA) models were built for comparison and analysis. Au/Sn bonding shows the best thermal and mechanical properties. Silver paste shows lower contact thermal resistance compared with solder paste. Although the thickness of the silver paste bonding layer is greater than the solder paste bonding layer, the average total thermal resistance is noticeably lower than the solder paste bonded samples.

UR - http://www.scopus.com/inward/record.url?scp=84860387479&partnerID=8YFLogxK

U2 - 10.1016/j.microrel.2011.03.029

DO - 10.1016/j.microrel.2011.03.029

M3 - 期刊論文

AN - SCOPUS:84860387479

SN - 0026-2714

VL - 52

SP - 872

EP - 877

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 5

ER -

A study of large area die bonding materials and their corresponding mechanical and thermal properties

Abstract

Access to Document

Fingerprint

Cite this