A novel method for real-time wafer positioning during transfer process

Yi Cheng Chen, Yu Pin Chen, Ju Yi Lee

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

This study proposed a novel method for real-time detection of wafer position on a robot blade during the transfer process. The wafer positioning system comprises two line-shaped beams spreading toward a scattefring surface on the way of wafer transfer. The images taken from a CCD (charge coupled device) camera mounted above the scattering surface are analyzed, and the instant position of the wafer center on the robot blade during the transfer process can be determined after image processing. The precision for the proposed wafer center detection is about 0.15mm according to the preliminary experimental results.

Original languageEnglish
Title of host publicationSICE 2011 - SICE Annual Conference 2011, Final Program and Abstracts
PublisherSociety of Instrument and Control Engineers (SICE)
Pages1933-1937
Number of pages5
ISBN (Print)9784907764395
StatePublished - 2011
Event50th Annual Conference on Society of Instrument and Control Engineers, SICE 2011 - Tokyo, Japan
Duration: 13 Sep 201118 Sep 2011

Publication series

NameProceedings of the SICE Annual Conference

Conference

Conference50th Annual Conference on Society of Instrument and Control Engineers, SICE 2011
Country/TerritoryJapan
CityTokyo
Period13/09/1118/09/11

Keywords

  • CCD
  • Image Processing
  • Wafer Positioning

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