Abstract
Oxygen ion implantation has been employed, for the first time, to form the high-resistance layer in the surface of GaAs MESFETs. Comparable DC and RF performance were achieved for MESFETs with and without oxygen ion implantation; however, MESFETs with the extra surface oxygen ion implantation demonstrated good breakdown performance, less frequency dispersion of drain current, and good time dependence of drain current at 150 °C in air. This enhancement is a result of the lower surface trapping effects resulting form a high-resistance layer by oxygen ion implantation. This approach relaxes the surface passivation problem in a standard GaAs MESFET.
Original language | English |
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Pages (from-to) | 1151-1154 |
Number of pages | 4 |
Journal | Solid-State Electronics |
Volume | 46 |
Issue number | 8 |
DOIs | |
State | Published - Aug 2002 |