A fully SiP integrated V-band butler matrix end-fire beam-switching transmitter using flip-chip assembled CMOS chips on LTCC

Che Chung Kuo, Hsin Chia Lu, Po An Lin, Chen Fang Tai, Yue Ming Hsin, Huei Wang

Research output: Contribution to journalArticlepeer-review

25 Scopus citations

Abstract

In this paper, a fully system-in-package (SiP) integrated V-band Butler matrix beam-switching transmitter (TX) is presented. The CMOS chips from differential process technologies are assembled on a low-temperature co-fired ceramic (LTCC) substrate carrier by flip-chip interconnects. The vertically embedded folded monopole antenna is designed and integrated into the LTCC. The array consisting of four identical monopole antennas and a Butler matrix for beam switching is realized on the LTCC for loss reduction. Four switched main beams are measured and agree well with simulation. This beam-forming TX shows the potential of the low-cost millimeter-wave SiP with CMOS chips.

Original languageEnglish
Article number6172540
Pages (from-to)1424-1436
Number of pages13
JournalIEEE Transactions on Microwave Theory and Techniques
Volume60
Issue number5
DOIs
StatePublished - 2012

Keywords

  • Butler
  • CMOS
  • flip-chip
  • phase array
  • V-band

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