A fully SiP integrated V-band butler matrix end-fire beam-switching transmitter using flip-chip assembled CMOS chips on LTCC

Che Chung Kuo; Hsin Chia Lu; Po An Lin; Chen Fang Tai; Yue Ming Hsin; Huei Wang

doi:10.1109/TMTT.2012.2187795

A fully SiP integrated V-band butler matrix end-fire beam-switching transmitter using flip-chip assembled CMOS chips on LTCC

Che Chung Kuo, Hsin Chia Lu, Po An Lin, Chen Fang Tai, Yue Ming Hsin, Huei Wang

Department of Electrical Engineering

Research output: Contribution to journal › Article › peer-review

25 Scopus citations

Abstract

In this paper, a fully system-in-package (SiP) integrated V-band Butler matrix beam-switching transmitter (TX) is presented. The CMOS chips from differential process technologies are assembled on a low-temperature co-fired ceramic (LTCC) substrate carrier by flip-chip interconnects. The vertically embedded folded monopole antenna is designed and integrated into the LTCC. The array consisting of four identical monopole antennas and a Butler matrix for beam switching is realized on the LTCC for loss reduction. Four switched main beams are measured and agree well with simulation. This beam-forming TX shows the potential of the low-cost millimeter-wave SiP with CMOS chips.

Original language	English
Article number	6172540
Pages (from-to)	1424-1436
Number of pages	13
Journal	IEEE Transactions on Microwave Theory and Techniques
Volume	60
Issue number	5
DOIs	https://doi.org/10.1109/TMTT.2012.2187795
State	Published - 2012

Keywords

Butler
CMOS
flip-chip
phase array
V-band

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10.1109/TMTT.2012.2187795

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title = "A fully SiP integrated V-band butler matrix end-fire beam-switching transmitter using flip-chip assembled CMOS chips on LTCC",

abstract = "In this paper, a fully system-in-package (SiP) integrated V-band Butler matrix beam-switching transmitter (TX) is presented. The CMOS chips from differential process technologies are assembled on a low-temperature co-fired ceramic (LTCC) substrate carrier by flip-chip interconnects. The vertically embedded folded monopole antenna is designed and integrated into the LTCC. The array consisting of four identical monopole antennas and a Butler matrix for beam switching is realized on the LTCC for loss reduction. Four switched main beams are measured and agree well with simulation. This beam-forming TX shows the potential of the low-cost millimeter-wave SiP with CMOS chips.",

keywords = "Butler, CMOS, flip-chip, phase array, V-band",

author = "Kuo, {Che Chung} and Lu, {Hsin Chia} and Lin, {Po An} and Tai, {Chen Fang} and Hsin, {Yue Ming} and Huei Wang",

note = "Funding Information: Manuscript received October 04, 2011; revised January 03, 2012; accepted January 10, 2012. Date of publication March 21, 2012; date of current version April 27, 2012. This work was supported in part by the National Science Council of Taiwan, R.O.C., under Contract NSC 98-2219-E-002-005, Contract NSC 98-2219-E-002-010, Contract NSC 98-2221-E-008-112-MY2, Contract NSC 98-2221-E-002-059-MY3, Contract NSC 99-2219-E-002-005, and Contract NSC 99-2219-E-002-010) and by National Taiwan University under Excellent Research Project 98R0062-01 and Project 98R0062-03.",

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A fully SiP integrated V-band butler matrix end-fire beam-switching transmitter using flip-chip assembled CMOS chips on LTCC. / Kuo, Che Chung; Lu, Hsin Chia; Lin, Po An; Tai, Chen Fang; Hsin, Yue Ming; Wang, Huei.

In: IEEE Transactions on Microwave Theory and Techniques, Vol. 60, No. 5, 6172540, 2012, p. 1424-1436.

Research output: Contribution to journal › Article › peer-review

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AU - Kuo, Che Chung

AU - Lu, Hsin Chia

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AU - Tai, Chen Fang

AU - Hsin, Yue Ming

AU - Wang, Huei

N1 - Funding Information: Manuscript received October 04, 2011; revised January 03, 2012; accepted January 10, 2012. Date of publication March 21, 2012; date of current version April 27, 2012. This work was supported in part by the National Science Council of Taiwan, R.O.C., under Contract NSC 98-2219-E-002-005, Contract NSC 98-2219-E-002-010, Contract NSC 98-2221-E-008-112-MY2, Contract NSC 98-2221-E-002-059-MY3, Contract NSC 99-2219-E-002-005, and Contract NSC 99-2219-E-002-010) and by National Taiwan University under Excellent Research Project 98R0062-01 and Project 98R0062-03.

PY - 2012

Y1 - 2012

N2 - In this paper, a fully system-in-package (SiP) integrated V-band Butler matrix beam-switching transmitter (TX) is presented. The CMOS chips from differential process technologies are assembled on a low-temperature co-fired ceramic (LTCC) substrate carrier by flip-chip interconnects. The vertically embedded folded monopole antenna is designed and integrated into the LTCC. The array consisting of four identical monopole antennas and a Butler matrix for beam switching is realized on the LTCC for loss reduction. Four switched main beams are measured and agree well with simulation. This beam-forming TX shows the potential of the low-cost millimeter-wave SiP with CMOS chips.

AB - In this paper, a fully system-in-package (SiP) integrated V-band Butler matrix beam-switching transmitter (TX) is presented. The CMOS chips from differential process technologies are assembled on a low-temperature co-fired ceramic (LTCC) substrate carrier by flip-chip interconnects. The vertically embedded folded monopole antenna is designed and integrated into the LTCC. The array consisting of four identical monopole antennas and a Butler matrix for beam switching is realized on the LTCC for loss reduction. Four switched main beams are measured and agree well with simulation. This beam-forming TX shows the potential of the low-cost millimeter-wave SiP with CMOS chips.

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A fully SiP integrated V-band butler matrix end-fire beam-switching transmitter using flip-chip assembled CMOS chips on LTCC

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Keywords

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