A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition

Yu Chieh Huang, Po Tsang Huang, Yu Chen Hu, Shang Lin Wu, Yan Huei You, Yung Kuei Wang, Jeng Ren Duann, Tzai Wen Chiu, Wei Hwang, Kuan Neng Chen, Ching Te Chuang, Jin Chern Chiou

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

To enhance the signal integrity of high-density neural-sensing signals, this work presents an implantable high spatial resolution μ-probe array with through-silicon via (TSV) 2.5D integration technology that realizes a miniaturized implantable device on flexible printed circuit (FPC) interposer. The proposed microsystem was composed of two 32-channel neural sensing chips and one radio frequency chip for neural signal processing. The μ-probe array can achieve better signal-to-noise ratio with neural-signal acquisition and processing circuit composed of a pseudo-resistor-based analog front-end amplifier. Moreover, a receiving antenna is also implemented on the backside of FPC for wireless data and power transmission. The feasibility of the proposed μ-probe array, Tx and Rx antenna, 32-channel neural sensing circuits in the 64-channel wireless microsystem have been successfully demonstrated for future integration and animal experiments.

Original languageEnglish
Title of host publicationTRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages28-31
Number of pages4
ISBN (Electronic)9781538627310
DOIs
StatePublished - 26 Jul 2017
Event19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017 - Kaohsiung, Taiwan
Duration: 18 Jun 201722 Jun 2017

Publication series

NameTRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems

Conference

Conference19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017
Country/TerritoryTaiwan
CityKaohsiung
Period18/06/1722/06/17

Keywords

  • 2.5 D integration
  • Flexible printed circuit (FPC)
  • neural signal
  • through-silicon via (TSV)

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