A 3.5-GHz SiGe 0.35μm HBT flip-chip assembled on ceramics integrated passive device Doherty power amplifier for SiP integration

Che Chung Kuo, Po An Lin, Jing Lin Kuo, Hsin Chia Lu, Yue Ming Hsin, Huei Wang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

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