@inproceedings{6d5cf060efae462fb4777d00e342cad4,
title = "3D Test Wrapper Chain Optimization with I/O Cells Binding Considered",
abstract = "Previous 3D test wrapper chain synthesis algorithms do not consider the binding of I/O cells (i.e., the association between scan chains and I/O cells). However, the binding of I/O cells may be specified as synthesis constraints. In this paper, we propose a 3D test wrapper chain optimization algorithm with I/O cells binding considered. Our objective is not only to reduce the required test time but also to reduce the number of test TSVs (through-silicon-vias) under I/O cells binding constraints. Our experiments show that the proposed algorithm greatly reduces both test time and test TSV count.",
keywords = "Optimization Algorithm, TSV Count, Test TSV, Test Time, Test Wrapper Chain Synthesis",
author = "Tang, {Fan Hsuan} and Kao, {Hsu Yu} and Huang, {Shih Hsu} and Li, {Jin Fu}",
note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 2019 IEEE International 3D Systems Integration Conference, 3DIC 2019 ; Conference date: 08-10-2019 Through 10-10-2019",
year = "2019",
month = oct,
doi = "10.1109/3DIC48104.2019.9058794",
language = "???core.languages.en_GB???",
series = "IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "IEEE 2019 International 3D Systems Integration Conference, 3DIC 2019",
}