Keyphrases
Bismuth Telluride
77%
Sn Film
66%
Grain Thickness
66%
Sn Whisker
66%
Interfacial Stability
66%
Grain Size
66%
Whisker Growth
66%
Film Grain
66%
Thermoelectric Module
50%
Thermoelectric Properties
50%
Interfacial Reaction
50%
Diffusion Barrier
38%
Thermoelectric Materials
38%
Thermoelectric Efficiency
33%
Metal Electrode
33%
Thin Film Thermoelectric
33%
Electroless
33%
Whisker
26%
Growth Rate
26%
Low-temperature Region
16%
Aging
16%
Fracture Mode
16%
Effective Diffusion
16%
Soldering
16%
Intermetallic Compound Layer
16%
SnTe
16%
High Figure of Merit
16%
Spontaneous Growth
13%
Axial Stress
13%
Thick Film
13%
Microstructure
13%
Steady State
13%
Low Temperature
11%
Industrial Society
11%
PbTe
11%
CoSb3
11%
Mid-temperature
11%
Intermetallic Compounds
11%
First Year
11%
Material Selection
11%
Academic Society
11%
Interdiffusion
11%
Working Temperature
11%
Material Science
Thermoelectrics
100%
Film
66%
Grain Size
66%
Thermoelectric Materials
44%
Intermetallics
38%
Thin Films
33%
Bismuth
33%
Thick Films
11%
Material Selection
5%