Study on Electrochemical Fabrication (Plating and Micro-Electroplating) and Comparison of Thin-Film and Micro-Helix Structures of Cu-Based Shape Memory Alloys

Project Details


The goal of this project concentrates on the electrochemical preparation of copper-based shapememoryalloying thin films and spiral microstructures and the characterization study. Theacademic interest is on the theorem of electrochemical deposition of binary (i.e., Cu-Zn) andternary copper alloys (i.e., Cu-Zn-Al,) in the aqueous baths and those of ionic liquid. Thetechnical interest is to develop the innovative electrochemical fabrication process for the thinfilms and 3-D microstructural alloys. Compositional control of the active elements (like Zn, Al,)in the alloys is focused to understand its effect on the surface morphology, crystalline structure.The further effect resulted from composition, morphology and microstructure on the function ofshape memory, mechanical properties and corrosion resistance is also concerned. Thedistribution of electric field determined by the electrochemical process exerted to prepare thethin films and that applied to fabricate the micro spirals is compared and discussed in depth.Furthermore, adequate parameters for the rapid heat-treatment (including temperature and time)to determine the microstructure, mechanical properties and corrosion resistance of copper-basedshape memory alloys are of interest.This project is biannually executed to accomplish the items summarized below:The 1st year: On the optimal parameters for the electrochemical process to prepare thin films andmicro scale spirals of copper-based Cu-Zn alloys from both baths of aqueous and ionicliquid, respectively. Compositional effect of the active elements (i.e., Zn) in the alloys onthe surface morphology, crystalline structure is mainly concerned. The dependence of thefunction of shape memory, mechanical properties and corrosion resistance on differentalloys are also of interest.The 2nd year: Developing the electrochemical processes adequate for fabrication of thin filmsand micro scale spirals, respectively, of the copper-based ternary alloys (i.e., Cu-Zn-Al)accompanied with their characterization study. This innovative electrochemical processoffers significant application to manufacture thin films and 3-D microstructural alloys usedin the micro actuators devices, microelectromechanical systems (MEMS) and the roboticindustry.
Effective start/end date1/08/1731/10/18

UN Sustainable Development Goals

In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This project contributes towards the following SDG(s):

  • SDG 9 - Industry, Innovation, and Infrastructure
  • SDG 12 - Responsible Consumption and Production
  • SDG 17 - Partnerships for the Goals


  • alloying thin-films
  • micro spirals
  • electrochemical process
  • shape memory
  • copperbasedalloys
  • mechanical property
  • corrosion resistance


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