The project "Identification of the Defect Uniformity in Volume Production Wafer Maps – Part II: SunBurst on the Scene" is the continuation of the upcoming wafer map analysis system. In the previous year'sresearch results, a Boomerang Chart is constructed from a two-dimensional wafermap image into a pair oftwo parameters, where the two parameters are the number of bad dice and the number of contiguous lines.On the coordinates plotted with these two parameters, a wafer map is represented as a point, a number ofwafer maps with uniform defects and different yields, which, on the new plot, form a Boomerang. It can beused to identify the wafer map is a uniform distribution of defects. If the coordinate point falls outside theBoomerang, we will be judged as non-uniform, otherwise, if in the Boomerang, it is judged as uniform. Itcan effectively and robustly determine the uniformity of wafer defect distribution.This year the project is divided into two topics: (a) Boomerang Formulation, I have to formulate theBoomerang Chart, direct expression with wafer yield, die size and confidence level of the formula, as if todo a capture Butterfly nets, will be with the butterfly variety, size, and hope that the loss rate to decide. (B)the Effective Number of Wafermap, wafer yield is a good choice, but it is not fully able to express theuniformity of defect distribution. From the two parameters - the numbers of bad dice and contiguous lines,A new number of features - the effective number is formed. When the wafer pattern defect distribution isuniform, the effective number will approximate the average number of defects - the number of defects oneach die. The small effective number shows an over-clustering phenomenon, and large that there isanti-clustering phenomenon. The non-uniform distribution will be further re-classified as over-clusteringand anti-clustering.
|Effective start/end date||1/08/17 → 31/07/18|
UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This project contributes towards the following SDG(s):
- Wafer Map
- Fatal Defect
- Process Variation
- Yield Analysis
- Monte Carlo Method
- Defect Number
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