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Effect of LED Die-Attachment on Stress in GaN Eip-Layers and Anelastic Behavior(2/3)
劉, 正毓
(PI)
Department of Chemical and Materials Engineering
Overview
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Research output
(1)
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Explore the research topics touched on by this project. These labels are generated based on the underlying awards/grants. Together they form a unique fingerprint.
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Weight
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Engineering & Materials Science
Nanorods
100%
Tin oxides
92%
Zinc oxide
89%
Indium
87%
Seed
69%
Aluminum
51%
Etching
20%
Substrates
20%
Microstructure
12%
Crystallinity
11%
Masks
9%
Temperature
7%
Physics & Astronomy
indium oxides
66%
nanorods
66%
zinc oxides
64%
tin oxides
64%
seeds
48%
aluminum
46%
light emitting diodes
26%
ITO (semiconductors)
15%
nuclei
14%
attachment
13%
etching
11%
microstructure
8%
crystallinity
6%
masks
6%
Chemical Compounds
Zinc Oxide
65%
Nanorod
57%
Etching
17%
Hexagonal Space Group
15%
Microstructure
12%
Hydrothermal Method
7%
Crystallinity
7%
Dimension
7%
Surface
6%
Ambient Reaction Temperature
5%