Development of High Value Technology for Gallium Nitride Circulating Materials( II )

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2021
Preparation of Co-Fe-Ni alloy micropillar by microanode-guided electroplating
Tseng, Y. T., Wu, G. X., Lin, J. C., Hwang, Y. R., Wei, D. H., Chang, S. Y. & Peng, K. C., 10 Dec 2021, In: Journal of Alloys and Compounds. 885, 160873.
Research output: Contribution to journal › Article › peer-review
14 Scopus citations
2020
Three-dimensional amorphous Ni−Cr alloy printing by electrochemical additive manufacturing
Tseng, Y. T., Lin, J. C., Shian-Ching Jang, J., Tsai, P. H., Ciou, Y. J. & Hwang, Y. R., 24 Nov 2020, In: ACS Applied Electronic Materials. 2, 11, p. 3538-3548 11 p.
Research output: Contribution to journal › Article › peer-review
11 Scopus citations

Research output