Development of Cu Recycling for Micro Cu Powders Used in Electronics-Grade Cu Slurry( III )

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2020
Effect of eutectic reaction between depositing atoms and substrate elements on morphological evolution of Sn–Bi–Sn multilayer deposition
Tang, Y. K., Lin, E. J., Wang, J. Y., Lin, Y. X., Wu, C. Y., Chiu, C. Y., Lee, C. H., Wang, C. P. & Liu, C. Y., 1 Aug 2020, In: Materials Chemistry and Physics. 250, 122960.
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