Development of Cu Recycling for Micro Cu Powders Used in Electronics-Grade Cu Slurry( II )

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2019
Kinetics of Ni solid-state dissolution in Sn and Sn3.5Ag alloys
Wang, J. Y., Tang, Y. K., Yeh, C. Y., Chang, P. J., Lin, Y. X., Lin, E. J., Wu, C. Y., Zhuang, W. X. & Liu, C. Y., 15 Aug 2019, In: Journal of Alloys and Compounds. 797, p. 684-691 8 p.
Research output: Contribution to journal › Article › peer-review
21 Scopus citations

Research output