Develop of Low Temperature Pb-Free Solder and the Study of Warpage on Electronic Packaging Assembled in Low Temperature(3/3)

2019
Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates
Tseng, T. H., Yang, C. H., Chiang, J. Y., Huang, J. J., Chen, C. H., Lin, S. K., Wang, C. M. & Wu, A. T., 24 Jun 2019, In: Materials Science and Engineering A. 759, p. 506-513 8 p.
Research output: Contribution to journal › Article › peer-review
1 Scopus citations
2018
Co-sputtered Cu(Ti) thin alloy film for formation of Cu diffusion and chip-level bonding
Lin, P. C., Chen, H., Hsieh, H. C., Tseng, T. H., Lee, H. Y. & Wu, A. T., 1 Jun 2018, In: Materials Chemistry and Physics. 211, p. 17-22 6 p.
Research output: Contribution to journal › Article › peer-review
8 Scopus citations

Research output