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Ambient Low Temperature Cu Bonding Technique(3/3)
Wu, Tzu-Chia
(PI)
Department of Chemical and Materials Engineering
Overview
Fingerprint
Research output
(2)
Research output
Research output per year
2021
2021
2021
2
Article
Research output per year
Research output per year
2 results
Publication Year, Title
(descending)
Publication Year, Title
(ascending)
Title
Type
Search results
2021
Low temperature and pressureless Cu-to-Cu direct bonding by green synthesized Cu nanoparticles
Liu, W., Wang, H., Huang, K. S., Wang, C. M. &
Wu, A. T.
,
Aug 2021
,
In:
Journal of the Taiwan Institute of Chemical Engineers.
125
,
p. 394-401
8 p.
Research output
:
Contribution to journal
›
Article
›
peer-review
Low Temperature
100%
Cu Nanoparticles
100%
Cu-Cu Bonding
100%
Pressureless
100%
Green Synthesized
100%
20
Scopus citations
Novel solid-state pressureless approach for Cu-embedded intermetallic interconnects at low temperature
Huang, K. S., Shen, T. H., Liu, W., Chao, J. L. &
Wu, A. T.
,
1 Nov 2021
,
In:
Materials Chemistry and Physics.
272
, 124966.
Research output
:
Contribution to journal
›
Article
›
peer-review
Intermetallics
100%
Low Temperature
100%
Solid State
100%
Intermetallic Compounds
100%
Pressureless
100%
1
Scopus citations