Keyphrases
Low Temperature
100%
Cu-Cu Bonding
66%
Pressureless
66%
Cu Nanoparticles
50%
Bonding Process
44%
Cu-Sn
33%
Solid State
33%
Intermetallic Compounds
33%
Green Synthesized
33%
Intermetallics
33%
High Power Devices
16%
3D IC
16%
Organic Polymer
16%
Cu-Cu
16%
Mechanical Mechanism
16%
Sintering Model
16%
Microstructure
16%
Microstructure Mechanism
16%
Direct Bonding
16%
Sn Nanoparticles
16%
X-ray Computed Tomography (X-CT)
16%
Flexible Polymer Substrate
16%
Sintering Temperature
16%
Polymer-ceramic Composites
16%
Electrical Mechanisms
16%
FIBTEM
16%
Organic Acids
16%
Sintering Mechanism
16%
Sintering Process
16%
Electrical Sintering
16%
Ambient Pressure
16%
Copper-containing Polymers
16%
Printed Circuit Board
16%
Electrical Microstructure
16%
Cu Wire
16%
Micron-sized
16%
Metallic Particles
16%
Polyethylene Glycol
16%
Cu Oxide
16%
Intermetallic Joints
11%
Compound Shell
11%
Cu-core
11%
Intermetallic Compound Thickness
11%
Coherent Interface
11%
Void Fraction
11%
Interfacial Area
11%
Interdiffusion
11%
Cu-based
11%
Joint Properties
11%
Shear Strength
11%
Joint Shear Strength
11%
SAC305
11%
In Situ TEM
11%
Cu-phase
11%
Mathematical Model
11%
Core Particle
11%
Solid-state Bonding
11%
Green Chemical Method
8%
Sintered Joint
8%
Close Packing Model
8%
Decomposed Products
8%
Random Close Packing
8%
Advanced Electronic Packaging
8%
PH Value
8%
Packaging Technique
8%
Packing Density
8%
Capping Agent
8%
Low-temperature Bonding
8%
Green Process
8%
Particle Size
8%
Fracture Surface
8%
High Conductivity
8%
Ductile Fracture
8%
Sintered Cu
8%
Bonding Strength
8%
Engineering
Low-Temperature
100%
Nanoparticle
66%
Interconnects
58%
Joints (Structural Components)
58%
Direct Bonding
50%
Sintering
33%
Intermetallics
33%
Sintering Temperature
16%
Power Device
16%
Ambient Pressure
16%
Polymer Substrate
16%
Sintering Process
16%
Shear Strength
11%
Packing Density
8%
Bonding Strength
8%
Realization
8%
Electronic Packaging
8%
Green Process
8%
Ductile Fracture
8%
Fracture Surface
8%
Coherent Interface
5%
Interdiffusion
5%
Mixed Phase
5%
Bonding Process
5%
Interfacial Area
5%
Porosity
5%
Mathematical Model
5%
Material Science
Nanoparticle
55%
Sintering
33%
Intermetallics
33%
Oxide Compound
16%
Polyethylene Glycol
16%
Sintering Temperature
11%
Focused Ion Beam
11%
Electron Backscatter Diffraction
11%
Shear Strength
11%
Electronic Circuit
11%
Organic Polymer
11%
Tomography
11%
Power Device
11%
Density
8%
Oxidation Reaction
8%
Chemical Processing
8%
Ductile Fracture
8%
Surface (Surface Science)
8%
Void Fraction
5%