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開發製作具三維立體Cu6Sn5及(Cu,Ni)6Sn5化合物支架銲點的錫膏(2/3)
Liu, Cheng-Yi
(PI)
Department of Chemical and Materials Engineering
Overview
Fingerprint
Research output
(1)
Project Details
Status
Finished
Effective start/end date
1/08/23
→
31/07/24
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Fingerprint
Explore the research topics touched on by this project. These labels are generated based on the underlying awards/grants. Together they form a unique fingerprint.
Single Grain
Keyphrases
100%
Sn-rich
Keyphrases
100%
Undercooling
Keyphrases
100%
Heterogeneous nucleation
Keyphrases
100%
Microbump
Keyphrases
100%
Soldering
Keyphrases
100%
Heterogeneous Nucleation
Engineering
100%
Pd-Ni-P
Keyphrases
60%
Research output
Research output per year
2024
2024
2024
1
Article
Research output per year
Research output per year
Single-grain Sn-rich micro-bump by reducing Sn undercooling with heterogeneous nucleation
Tsai, C. P., Chiu, C. Y., Huang, W. C.,
Liu, C. Y.
, Chang, J. S., Chiu, C. N. & Chuang, Y. C.,
15 Feb 2024
,
In:
Materials Letters.
357
, 135729.
Research output
:
Contribution to journal
›
Article
›
peer-review
Soldering
100%
Heterogeneous nucleation
100%
Microbump
100%
Single Grain
100%
Undercooling
100%
2
Scopus citations