感光性介電材料表面改質對黏著性影響之研究

Project Details

Description

計畫將首先著重於以雷射應用在PCB板的分板/分割(Depaneling/Singulation)、穴孔製作(Cavity Fabrication)與銅箔膜封合(Copper Foil Sealing)等技術發展為主題,欣興電子目前線上製造時所遇到的問題為載具,開發採雷射加工製程的可能解決方案,以期提高製程品質,改進生產良率,增加生產效益。研發過程將以欣興研發團隊為直接對口,動態討論研發進度,提高產學合作效益。同時,本計畫的研發結果,也希望能成為未來開發智慧型雷射加工專用機台的基礎。
StatusFinished
Effective start/end date1/03/2228/02/23

UN Sustainable Development Goals

In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This project contributes towards the following SDG(s):

  • SDG 4 - Quality Education
  • SDG 7 - Affordable and Clean Energy
  • SDG 8 - Decent Work and Economic Growth
  • SDG 9 - Industry, Innovation, and Infrastructure
  • SDG 12 - Responsible Consumption and Production

Keywords

  • PCB

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