Project Details
Description
By cooperating with Shengmao Technology Co., Ltd., new electronic packaging and assembly bonding materials can be developed, which are suitable for low-temperature process bonding materials in high-temperature environments. It is expected that through academic research and publication of results, the international reputation and visibility of Shengmao Technology will be enhanced.
Status | Active |
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Effective start/end date | 1/08/23 → 31/07/26 |
UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This project contributes towards the following SDG(s):
Keywords
- Advanced packaging
- Pb-free solder
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