先進封裝材料及技術研究開發

Project Details

Description

By cooperating with Shengmao Technology Co., Ltd., new electronic packaging and assembly bonding materials can be developed, which are suitable for low-temperature process bonding materials in high-temperature environments. It is expected that through academic research and publication of results, the international reputation and visibility of Shengmao Technology will be enhanced.
StatusActive
Effective start/end date1/08/2331/07/26

UN Sustainable Development Goals

In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This project contributes towards the following SDG(s):

  • SDG 1 - No Poverty
  • SDG 3 - Good Health and Well-being
  • SDG 4 - Quality Education
  • SDG 7 - Affordable and Clean Energy
  • SDG 8 - Decent Work and Economic Growth
  • SDG 9 - Industry, Innovation, and Infrastructure
  • SDG 11 - Sustainable Cities and Communities
  • SDG 12 - Responsible Consumption and Production
  • SDG 17 - Partnerships for the Goals

Keywords

  • Advanced packaging
  • Pb-free solder

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