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Tzu-Chia Wu

Professor, Associate Dean for College of Engineering

Calculated based on number of publications stored in Pure and citations from Scopus
20042024

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  • 2024

    Cu Nanoparticle Sintering by Electrical Current

    Wu, A. T., Sheng, T. H., Chao, J. L., Wang, C. M. & Tseng, W., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 107-108 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Develop new solder alloy for high reliability device

    Wu, A. T., Tseng, W., Wang, C. M. & Lin, W. T., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers Inc., p. 1144-1147 4 p. (Proceedings - Electronic Components and Technology Conference).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • 2023

    Hybrid SnBi/SAC Low-Temperature Solder Bump

    Wu, A. T., Chao, J. L., Lai, Y. Y. & Wang, C. M., 2023, 2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc., p. 213-214 2 p. (2023 International Conference on Electronics Packaging, ICEP 2023).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    2 Scopus citations
  • 2018

    Corrosion resistance of surface finishes for high reliability devices

    Tseng, T. H. & Wu, A. T., 2 Jul 2018, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 206-209 4 p. 8625719. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; vol. 2018-October).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    1 Scopus citations

  • Development of low temperature solder alloys for advanced electronic packaging: Assessment of In-Bi alloys on Cu substrates

    Wu, A. T., Chen, C. H., Huang, J. J., Chiang, J. Y. & Wang, C. M., 6 Jun 2018, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 128-131 4 p. (2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    3 Scopus citations
  • 2016

    Creep corrosion on high reliability printed circuit boards

    Tseng, T. H., Wu, A. T., Chang, Y. T., Shi, H. C. & Lee, J., 27 Dec 2016, 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings. IEEE Computer Society, p. 156-158 3 p. 7800024. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    1 Scopus citations

  • Development of New Low Melting Solder Alloys

    Chen, C. H., Lee, B. H., Chen, H. C., Wang, C. M. & Wu, A. T., 16 Aug 2016, Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 2501-2506 6 p. 7545777. (Proceedings - Electronic Components and Technology Conference; vol. 2016-August).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    3 Scopus citations

  • Non-destructive testing method for chip warpage -Applications of synchrotron radiation X-ray

    Hsu, H. H., Wang, C. M., Lee, H. Y. & Wu, A. T., 7 Jun 2016, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 15-18 4 p. 7486772. (2016 International Conference on Electronics Packaging, ICEP 2016).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    1 Scopus citations
  • 2015

    Massive spalling in Pb-free solder on co-based surface finishes

    Huang, C. H., Tsai, Y. L., Chang, Y. T. & Wu, A. T., 20 May 2015, ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., p. 586-589 4 p. 7111082. (ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    1 Scopus citations
  • 2011

    Analysis of antimony doped SnO 2 thin film by synchrotron grazing incidence X-ray diffraction

    Lin, Y. Y., Wu, A. T., Ku, C. S. & Lee, H. Y., 2011, Program - 37th IEEE Photovoltaic Specialists Conference, PVSC 2011. p. 1768-1770 3 p. 6186296. (Conference Record of the IEEE Photovoltaic Specialists Conference).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • 2010

    Electrical current induced local thermal stress caused on stacked 3D-ICs

    Hsu, H. H., Chang, T. C., Chen, C., Lee, H. Y. & Wu, A. T., 2010, International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 5699582. (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    1 Scopus citations

  • The in-situ measurement of thermal stress on stacked 3D-IC by utilizing synchrotron radiation x-ray

    Hsu, H. H., Chang, T. C., Chen, C., Lee, H. Y. & Wu, A. T., 2010, International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 5699581. (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • 2008

    The composition of intermetallic compounds in Sn-Ag-Bi-In solders on Cu substrates

    Chen, M. H., Jieng, Y. Y. & Wu, A. T., 2008, 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008. p. 209-211 3 p. 4783846. (2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • 2005

    Microstructure evolution of tin under electromigration studied by synchrotron x-ray micro-diffraction

    Wu, A. T., Lloyd, J. R., Tamura, N. & Tu, K. N., 2005, Proceedings - 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces. p. 178-180 3 p. 1432073. (Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces; vol. 2005).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    Open Access
    1 Scopus citations