Keyphrases
Intermetallic Compounds
72%
Soldering
63%
Electromigration
55%
Cu Substrate
35%
Diffusion Barrier
35%
Whisker Growth
32%
Surface Finish
31%
3D IC
30%
Interfacial Reaction
26%
Synchrotron Radiation X-ray
26%
Current Stressing
25%
Thermoelectric Materials
24%
Bismuth Telluride
24%
Microstructure
19%
Electrical Current
18%
Sn Whisker
18%
Whisker
18%
Cu6Sn5
17%
Solder Alloys
17%
Electroless
16%
Pb-free Solder
16%
Amorphous InGaZnO (a-IGZO)
14%
Current Density
14%
Thermoelectric Module
14%
Microbump
14%
Annealing
14%
Kinetic Analysis
14%
Ag3Sn
13%
Tin Whisker
13%
Thermal Stress
13%
Mechanical Strength
13%
Microstructure Evolution
12%
In Situ
12%
Synchrotron X-ray
12%
Ni-Sn
12%
Massive Spalling
12%
Co-based
12%
Solder Joint
12%
Ni3S4
11%
Low Temperature
11%
Grazing Incidence X-ray Diffraction (GIXRD)
11%
High Reliability
11%
In Situ Synchrotron X-ray Diffraction
11%
Electric Current
10%
Co-sputtering
10%
Shear Test
10%
Cu-Sn
10%
Tin Oxide Thin Film
10%
NiTe
9%
Electroless Cobalt
9%
Material Science
Intermetallics
100%
Tin
47%
Surface (Surface Science)
46%
Thin Films
45%
Film
43%
Density
35%
Thermoelectrics
34%
Electronic Circuit
31%
X-Ray Diffraction
31%
Thermoelectric Materials
26%
Lead-Free Solder
24%
Solder Joint
19%
Grain Boundary
17%
Tin Oxide
17%
Thermal Expansion
17%
Silicon
16%
Shear Testing
16%
Nanoparticle
14%
Corrosion
14%
Antimony
13%
Oxide Compound
12%
Crystal Structure
12%
Electrical Resistivity
12%
Thermal Stress
12%
Nanorod
12%
Thermal Aging
11%
Microstructural Evolution
11%
Annealing
10%
Cathode
10%
Scanning Electron Microscopy
9%
Synchrotron X-Ray Diffraction
9%
Grain Size
9%
Shear Strength
9%
Cobalt
8%
Residual Stress
8%
Stress Analysis
8%
ZnO
8%
Bismuth
7%
Corrosion Resistance
6%
Electron Backscatter Diffraction
6%
Diffusivity
6%
Creep
6%
Sintering
6%
Doping (Additives)
5%
Activation Energy
5%
Stress Relaxation
5%
Microsphere
5%
Composite Material
5%
Chemical Vapor Deposition
5%
Physical Property
5%
Engineering
Intermetallics
55%
Joints (Structural Components)
39%
Thin Films
32%
Ray Diffraction
21%
Thermoelectricity
18%
Diffusion Barrier
17%
Free Solder
17%
Electromigration
16%
Low-Temperature
15%
Melting Point
14%
Nanoparticle
11%
Shear Strength
11%
Printed Circuit Board
10%
Eutectics
10%
Thermoelectric Materials
10%
Underfill
10%
Thermal Stress
10%
Experimental Result
8%
Situ Measurement
8%
Phase Separation
8%
Finite Element Analysis
8%
Integrated Circuit
8%
Silicon Dioxide
8%
Corrosion Product
7%
Corrosion Resistance
7%
Diffusion Behavior
7%
Driving Force
7%
Electroless Nickel
7%
Growth Kinetics
6%
Electronic Packaging
6%
Joint Strength
6%
Three Dimensional Integrated Circuits
6%
Aging Temperature
6%
Expansion Coefficient
6%
Dopants
6%
Residual Stress
6%
Solar Cell
6%
Failure Mode
5%
Coefficient of Performance
5%
Thermal Cycle
5%
Melting Temperature
5%
Creep
5%
Concentration Gradient
5%
Compressive Stress
5%
Interdiffusion
5%
Reliability Issue
5%
Failure Time
5%
