Projects per year
Personal profile
Research Expertise
Advanced electronic packaging technology, thin-film solar cells, synchrotron radiation in materials
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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Enhancing Reliability and Durability of Solder Joints Using a Novel Sn-Ag-Bi-Ni Alloy
Lin, W. T., Li, K., Lin, K. S., Wang, C. M. & Wu, A. T., 2025, (Accepted/In press) In: JOM.Research output: Contribution to journal › Article › peer-review
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Interfacial reaction and IMC growth kinetics at the Bi2Te3/Ag interface during isothermal aging
Pak, S. W., Tatsumi, H., Wang, J., Wu, A. T. & Nishikawa, H., Apr 2025, In: Intermetallics. 179, 108686.Research output: Contribution to journal › Article › peer-review
Open Access -
Cu Nanoparticle Sintering by Electrical Current
Wu, A. T., Sheng, T. H., Chao, J. L., Wang, C. M. & Tseng, W., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 107-108 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Develop new solder alloy for high reliability device
Wu, A. T., Tseng, W., Wang, C. M. & Lin, W. T., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers Inc., p. 1144-1147 4 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Enhancement of Cu-to-Cu bonding property by residual stress in Cu substrate
Wang, H., Chen, P. H., Kung, C. H., Chang, P. K., Chiu, S. J., Lin, Y. G., Wang, C. M. & Wu, A. T., Aug 2024, In: Materials Characterization. 214, 114107.Research output: Contribution to journal › Article › peer-review
1 Scopus citations