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1996 …2024

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  • 1999

    Wafer bonding for microsystems technologies

    Gösele, U., Tong, Q. Y., Schumacher, A., Kräuter, G., Reiche, M., Plößl, A., Kopperschmidt, P., Lee, T. H. & Kim, W. J., 20 Apr 1999, In: Sensors and Actuators, A: Physical. 74, 1, p. 161-168 8 p.

    Research output: Contribution to journalConference articlepeer-review

    77 Scopus citations