Calculated based on number of publications stored in Pure and citations from Scopus
1996 …2023

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  • 2005

    A nano-thick SOI fabrication method

    Huang, C. H., Cheng, J. T., Hsu, Y. K., Chang, C. L., Wang, H. W., Lee, S. L. & Lee, T. H., 2005, p. 431-438. 8 p.

    Research output: Contribution to conferencePaperpeer-review

  • Thermal-microwave hybrid SOI materials technology

    Cheng, J. T., Huang, C. H., Hsu, Y. K., Chang, C. L., Wang, H. W., Gan, G., Lee, S. L. & Lee, T. H., 2005, p. 414-423. 10 p.

    Research output: Contribution to conferencePaperpeer-review

    1 Scopus citations
  • 1999

    Wafer bonding for microsystems technologies

    Gösele, U., Tong, Q. Y., Schumacher, A., Kräuter, G., Reiche, M., Plößl, A., Kopperschmidt, P., Lee, T. H. & Kim, W. J., 20 Apr 1999, In: Sensors and Actuators, A: Physical. 74, 1, p. 161-168 8 p.

    Research output: Contribution to journalConference articlepeer-review

    77 Scopus citations
  • 1997

    Low temperature Si layer splitting

    Tong, Q. Y., Lee, T. H., Huang, L. J., Chao, Y. L. & Gosele, U., 1997, p. 126-127. 2 p.

    Research output: Contribution to conferencePaperpeer-review

    5 Scopus citations
  • Semiconductor layer transfer by anodic wafer bonding

    Lee, T. H., Ton, Q. Y., Chao, Y. L., Huang, L. J. & Goesele, U., 1997, p. 40-41. 2 p.

    Research output: Contribution to conferencePaperpeer-review

  • 1996

    Feasibility study of VLSI device layer transfer by CMP PETEOS direct bonding

    Tong, Q. Y., Lee, T. H., Kim, W. J., Tan, T. Y., Goesele, U., You, H. M., Yun, W. & Sin, J. K. O., 1996, p. 36-37. 2 p.

    Research output: Contribution to conferencePaperpeer-review

    16 Scopus citations