Tien-Hsi Lee

Research activity per year

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2005
A nano-thick SOI fabrication method
Huang, C. H., Cheng, J. T., Hsu, Y. K., Chang, C. L., Wang, H. W., Lee, S. L. & Lee, T. H., 2005, p. 431-438. 8 p.
Research output: Contribution to conference › Paper › peer-review
Thermal-microwave hybrid SOI materials technology
Cheng, J. T., Huang, C. H., Hsu, Y. K., Chang, C. L., Wang, H. W., Gan, G., Lee, S. L. & Lee, T. H., 2005, p. 414-423. 10 p.
Research output: Contribution to conference › Paper › peer-review
1 Scopus citations
1997
Low temperature Si layer splitting
Tong, Q. Y., Lee, T. H., Huang, L. J., Chao, Y. L. & Gosele, U., 1997, p. 126-127. 2 p.
Research output: Contribution to conference › Paper › peer-review
5 Scopus citations
Semiconductor layer transfer by anodic wafer bonding
Lee, T. H., Ton, Q. Y., Chao, Y. L., Huang, L. J. & Goesele, U., 1997, p. 40-41. 2 p.
Research output: Contribution to conference › Paper › peer-review
1996
Feasibility study of VLSI device layer transfer by CMP PETEOS direct bonding
Tong, Q. Y., Lee, T. H., Kim, W. J., Tan, T. Y., Goesele, U., You, H. M., Yun, W. & Sin, J. K. O., 1996, p. 36-37. 2 p.
Research output: Contribution to conference › Paper › peer-review
16 Scopus citations

Research output