Calculated based on number of publications stored in Pure and citations from Scopus
1996 …2023

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  • 2022

    Low-Temperature Rough-Surface Wafer Bonding with AlN/AlN Via Oxygen Plasma Activation

    Huang, W. C., Nien, S. M., Ruan, J. L., Kuo, Y. K. & Lee, B. T. H., 2022, ECS Transactions. 1 ed. Institute of Physics, p. 49-50 2 p. (ECS Transactions; vol. 108, no. 1).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • 2018

    Rapid fabricating sub-50 nm FD-SOI: by secondary ion-cut processing

    Lee, B. T. H., Chang, Y. L., Huang, C. H., Ho, C. C., Lo, F. S. & Hwang, Y. R., 2 Jul 2018, 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference, S3S 2018. Institute of Electrical and Electronics Engineers Inc., 8640210. (2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference, S3S 2018).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

    1 Scopus citations
  • 2017

    Free-carrier absorption assisted photoelectrochemistry of silicon

    Lee, B. T. H., Chiang, C. C. & Hwang, Y. R., 2017, ECS Transactions. Abbott, A. P., Alkire, R., Allongue, P., Anderson, T. J., Bartlett, P. N., Bayachou, M., Bhansali, S., Birbilis, N., Bocarsly, A. B., Bock, C., Boltalina, O. V., Brankovic, S., Buchheit, R., Buttry, D. A., Calabrese Barton, S., Carter, M. T., Chaitanya, V., Cheek, G. T., Chen, Z., Chidambaram, D., Chin, B. A., Choi, J. W., Chu, D., Cliffel, D. E., Deligianni, H., Di Noto, V., Dimitrov, N., Doeff, M., Douglas, E. A., Druffel, T., Edstrom, K., Fenton, J. M., Fergus, J., Fransaer, J., Fukunaka, Y., Guyomard, D., Hamada, H., Haverhals, L. M., Hesketh, P., Hillier, A. C., Hite, J. K., Imahori, H., Inaba, M., Innocenti, M., Itagaki, M., Johnson, C., Katayama, H., Kilgore, S. H., Kim, D. J., Koehne, J., Kostecki, R., Krumdick, G., Kulesza, P. J., Leddy, J., Lee, J. J., Leonte, O., Lu, Y. C., Lucht, B. L., Lynch, R. P., Manivannan, M., Mantz, R. A., Marcus, P., Maurice, V., Mauter, M., Mauzeroll, J., McMurray, H. N., Meng, Y. S., Miller, E. L., Milosev, I., Minteer, S. D., Mitra, S., Mukerjee, S., Mukundan, R., Muldoon, J., Nagahara, L., Narayan, S. R., Natishan, P. M., Navaei, M., Nicholas, J. D., Noel, J., Nonnenmann, S. S., O'Dwyer, C., Orazem, M. E., Oren, Y., Park, J. G., Pharkya, P., Pintauro, P. N., Pylypenko, S., Rajeshwar, K., Ramasamy, R. P., Rhodes, C., Riemer, D. P., Roeper, D., Rohwerder, M., Romankiw, L., Rotkin, S. V., Rupp, J. L. M., Sailor, M. J., Schwartz, D. T., Sekhar, P. K., Sharma, N., Simonian, A., Smith, D. K., Smith, K. C., Soleymani, L., Stafford, G. R., Staser, J. A., Subramanian, V., Subramanian, V. R., Sundaram, K. B., Suroviec, A. H., Suto, K., Tao, M., Tatsuma, T., Trulove, P. C., Vanysek, P., Vasiljevic, N., Vaughey, J. T., Virtanen, S., Wang, H., Wang, W., Whitacre, J. F., Williams, G., Winter, M., Wood, D. L., Wu, G., Wu, N., Xiao, J., Xing, Y., Xu, H., Yang, J. J. & Zangari, G. (eds.). 10 ed. Electrochemical Society Inc., p. 1113-1125 13 p. (ECS Transactions; vol. 80, no. 10).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • Measurement of thickness of high-resistivity substrate by photoconduction enhanced capacitance displacement sensor

    Lee, B. T. H. & Lin, M. C., 2017, Selected Proceedings from the 231st ECS Meeting New Orleans, LA - Spring 2017. 11 ed. Electrochemical Society Inc., p. 1747-1752 6 p. (ECS Transactions; vol. 77, no. 11).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • 2015

    The suppression effect of 830 nm laser irradiation on porous silicon formation

    Chiang, C. C., Huang, Y. C., Juan, P. C., Lo, F. S. & Lee, T. H., 2015, Nanoscale Electrochemistry. Ito, T. & Kusoglu, A. (eds.). 35 ed. Electrochemical Society Inc., p. 1-7 7 p. (ECS Transactions; vol. 69, no. 35).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • 2014

    Enhancement of bonding strength for low temperature Si3N4/Si3N4 direct wafer bonding by nitrogen-plasma activation and hydrofluoric pre-dip

    Lo, F. S., Chiang, C. C., Li, C. & Lee, T. H., 2014, Semiconductor Wafer Bonding 13: Science, Technology, and Applications. Suga, T., Goorsky, M. S., Knechtel, R., Moriceau, H., Baumgart, H., Tan, C. S. & Hobart, K. D. (eds.). 5 ed. Electrochemical Society Inc., p. 111-117 7 p. (ECS Transactions; vol. 64, no. 5).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • 2006

    Layer transfer of hydrogen-implanted silicon wafers by thermal-microwave co-activation

    Yang, Y. Y., Huang, C. H., Hsu, Y. K., Jeng, S. J., Tai, C. C., Lee, S., Chen, H. W., Gan, Q., Chu, C. S., Ting, J. H., Lai, C. S. & Lee, T. H., 2006, Transistor Scaling-Methods, Materials and Modeling. Materials Research Society, p. 111-116 6 p. (Materials Research Society Symposium Proceedings; vol. 913).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

  • Nanothick layer transfer of hydrogen-implanted wafer using polysilicon sacrificial layer

    Huang, C. H., Chang, C. L., Yang, Y. Y., Suryasindhu, T., Liao, W. C., Su, Y. H., Li, P. W., Liu, C. Y., Lai, C. S., Ting, J. H., Chu, C. S., Lee, C. S. & Lee, T. H., 2006, Nanomanufacturing. Materials Research Society, p. 84-89 6 p. (Materials Research Society Symposium Proceedings; vol. 921).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review