Keyphrases
Annealing
29%
Anodic Bonding
13%
Blister
17%
Bond Energy
20%
Bonding Interface
20%
Bonding Strength
14%
Device Wafer
13%
FDSOI
13%
Free Carrier Absorption
13%
High Temperature
23%
High-resistivity Silicon (HR-Si)
12%
Hydrofluoric Acid
15%
Hydrogen Ion
15%
Implanted Silicon
12%
Insulator
10%
Ion-cutting
24%
Laser Irradiation
14%
Laser Power
10%
Layer Splitting
27%
Layer Transfer
65%
Low Temperature
35%
Metallic Interconnect
12%
Nanocrystals
16%
Nitrogen Plasma
12%
Oxidation Behavior
12%
Oxides
18%
P-type
16%
Photoconduction
12%
Photoluminescent
12%
Plasma Sputtering
12%
Polysilicon
21%
Porous Layer
19%
Porous Silicon
24%
Resistivity
12%
Sacrificial Layer
19%
Self-powered
10%
Si Layer
21%
Si Wafer
11%
Silica
15%
Silicon Layer
33%
Silicon Nitride
9%
Silicon Surface
23%
Silicon Wafer
35%
Silicon-on-insulator
11%
Smart-cut
14%
Surface Activation
9%
Surface Blistering
12%
Thickness Measurement
12%
Wafer
40%
Wafer Bonding
51%
Engineering
Anodization
15%
Bonding Pair
7%
Bonding Process
6%
Bonding Strength
20%
Capacitive
12%
Carrier Absorption
9%
Chemical Mechanical Polishing
7%
Crystalline Silicon
9%
Device Wafer
15%
Displacement Sensor
12%
Electrochemical Etching
7%
Energy Engineering
35%
Energy Harvesting
7%
Fabrication Method
7%
Heat Treatment
7%
Hydrophobic
8%
Implant
10%
Implanted Device
7%
Interdiffusion
6%
Ion Implantation
9%
Irradiated Surface
8%
Laser Irradiation
20%
Laser Power
10%
Low-Temperature
55%
Material Technology
7%
Microelectromechanical System
6%
Nanomaterial
10%
Nanometre
6%
Nanoscale
38%
Piezoelectric
13%
Plasma Activation
10%
Plasma Treatment
8%
Polysilicon
21%
Porous Layer
19%
Porous Silicon
25%
Room Temperature
7%
Root Mean Square
7%
Self-Powered
10%
Si Wafer
16%
Silicon Dioxide
16%
Silicon Layer
39%
Silicon on Insulator
9%
Silicon Oxide
13%
Silicon Surface
23%
Silicon Wafer
37%
Surface Activation
11%
Thermal Stress
9%
Thin Films
13%
Transfer Process
8%
Wafer Bonding
65%
Material Science
Activation Energy
9%
Alloy
6%
Aluminum Nitride
6%
Annealing
13%
Anodizing
20%
Boron
6%
Capacitance
6%
Composite Films
6%
Diamond
6%
Electrical Resistivity
13%
Electrochemical Etching
8%
Electronic Circuit
7%
Epitaxy
6%
Film
9%
Ion Implantation
9%
Microelectromechanical System
8%
Nanostructure
5%
Oxidation Reaction
15%
Oxide Compound
26%
Photoluminescence
9%
Poly Methyl Methacrylate
9%
Porous Silicon
26%
Rough Surface
6%
Silicon
100%
Silicon on Insulator Material
6%
Silicon Wafer
26%
Surface (Surface Science)
82%
Thin Films
14%
Transfer Process
8%
Transmission Electron Microscopy
7%