Keyphrases
Layer Transfer
63%
Wafer Bonding
49%
Wafer
39%
Silicon Wafer
34%
Low Temperature
34%
Silicon Layer
32%
Annealing
28%
Layer Splitting
26%
Porous Silicon
23%
Ion-cutting
23%
Silicon Surface
23%
High Temperature
22%
Si Layer
21%
Polysilicon
20%
Bond Energy
20%
Bonding Interface
19%
Sacrificial Layer
18%
Oxides
18%
Porous Layer
18%
Blister
17%
Nanocrystals
16%
P-type
16%
Silica
14%
Hydrofluoric Acid
14%
Hydrogen Ion
14%
Smart-cut
14%
Laser Irradiation
14%
Bonding Strength
14%
Anodic Bonding
13%
Free Carrier Absorption
13%
FDSOI
12%
Device Wafer
12%
Photoluminescent
11%
Thickness Measurement
11%
Photoconduction
11%
Resistivity
11%
Metallic Interconnect
11%
Oxidation Behavior
11%
Plasma Sputtering
11%
High-resistivity Silicon (HR-Si)
11%
Surface Blistering
11%
Implanted Silicon
11%
Nitrogen Plasma
11%
Silicon Nitride
11%
Si Wafer
11%
Silicon-on-insulator
11%
Laser Power
10%
Insulator
10%
Self-powered
9%
Surface Activation
9%
Engineering
Wafer Bonding
63%
Low-Temperature
53%
Silicon Layer
39%
Nanoscale
37%
Silicon Wafer
36%
Energy Engineering
34%
Porous Silicon
24%
Bonding Strength
23%
Silicon Surface
23%
Polysilicon
20%
Laser Irradiation
20%
Porous Layer
18%
Si Wafer
16%
Hydrophilicity
14%
Anodization
14%
Device Wafer
14%
Silicon Oxide
13%
Piezoelectric
12%
Thin Films
12%
Displacement Sensor
11%
Capacitive
11%
Surface Activation
11%
Laser Power
10%
Self-Powered
10%
Implant
10%
Plasma Activation
10%
Ion Implantation
9%
Crystalline Silicon
8%
Thermal Stress
8%
Silicon on Insulator
8%
Carrier Absorption
8%
Nanomaterial
8%
Hydrophobic
8%
Irradiated Surface
7%
Transfer Process
7%
Plasma Treatment
7%
Root Mean Square
7%
Implanted Device
7%
Fabrication Method
7%
Electrochemical Etching
7%
Chemical Mechanical Polishing
7%
Material Technology
7%
Energy Harvesting
7%
Transmissions
6%
Bonding Pair
6%
Heat Treatment
6%
Room Temperature
6%
Nitride
6%
Bonding Process
6%
Microelectromechanical System
6%
Material Science
Silicon
100%
Oxide Compound
26%
Silicon Wafer
25%
Porous Silicon
23%
Nanocrystalline Material
22%
Anodizing
19%
Oxidation Reaction
14%
Thin Films
13%
Electrical Resistivity
13%
Annealing
12%
Crystalline Material
12%
Ion Implantation
9%
Activation Energy
8%
Film
8%
Poly Methyl Methacrylate
8%
Microelectromechanical System
7%
Transfer Process
7%
Electronic Circuit
7%
Electrochemical Etching
7%
Photoluminescence
6%
Transmission Electron Microscopy
6%
Aluminum Nitride
5%
Rough Surface
5%
Waveguide
5%
Silicon on Insulator Material
5%
Capacitance
5%
Boron
5%
Alloy
5%
Composite Films
5%
Thermal Stress
5%
Diamond
5%
Epitaxy
5%
