Projects per year
Personal profile
Research Expertise
Semiconductor wafer bonding science and technology Nano single crystal thin film transfer science and technology
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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Collaborations and top research areas from the last five years
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Projects
- 13 Finished
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Study on Bonding Wafers with Hydrogen Bonds on Surface
Lee, T.-H. (PI)
1/03/22 → 30/11/22
Project: Research
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基於矽光子技術之快速多模組醫學檢測研發與應用--基於矽光子技術之快速多模組醫學檢測研發與應用(3/4)
Lee, T.-H. (PI)
1/08/20 → 31/07/21
Project: Research
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Nonthermal Effect of Microwave Processing Enhances Interface Reactivity and Microchannel Integrity: Low-Temperature Rapid Bonding of PMMA Microfluidic Devices
Li, S. C., Chen, J. R., Chiang, C. C., Tsai, Y. S. & Tien-Hsi Lee, B., 4 Mar 2025, In: ACS Omega. 10, 8, p. 7662-7671 10 p.Research output: Contribution to journal › Article › peer-review
Open Access -
Quasihomogeneous wafer bonding for fusing dissimilar materials via nanoscale homogenization layer deposition
Huang, W. C., Ruan, J. L., Kuo, Y. K. & Lee, B. T. H., Jun 2025, In: Materials Today Nano. 30, 100611.Research output: Contribution to journal › Article › peer-review
1 Scopus citations -
Fabrication of a Three-Dimensional Microfluidic System from Poly(methyl methacrylate) (PMMA) Using an Intermiscibility Vacuum Bonding Technique
Li, S. C., Chiang, C. C., Tsai, Y. S., Chen, C. J. & Lee, T. H., Apr 2024, In: Micromachines. 15, 4, 454.Research output: Contribution to journal › Article › peer-review
Open Access2 Scopus citations -
Low-Temperature Rough-Surface Wafer Bonding with AlN/AlN Via Oxygen Plasma Activation
Huang, W. C., Nien, S. M., Ruan, J. L., Kuo, Y. K. & Lee, B. T. H., 2022, ECS Transactions. 1 ed. Institute of Physics, p. 49-50 2 p. (ECS Transactions; vol. 108, no. 1).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Low-temperature rough-surface wafer bonding with aluminum nitride ceramics implemented by capillary and oxidation actions
Nien, S. M., Ruan, J. L., Kuo, Y. K. & Lee, B. T. H., 15 Mar 2022, In: Ceramics International. 48, 6, p. 8766-8772 7 p.Research output: Contribution to journal › Article › peer-review
11 Scopus citations