Projects per year
Personal profile
Research Expertise
Semiconductor wafer bonding science and technology Nano single crystal thin film transfer science and technology
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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Collaborations and top research areas from the last five years
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Fabrication of tapered waveguides by i-line UV lithography for flexible coupling control
Wang, P. H., Lee, T. H. & Huang, W. H., 30 Jan 2023, In: Optics Express. 31, 3, p. 4281-4290 10 p.Research output: Contribution to journal › Article › peer-review
Open Access1 Scopus citations -
Dispersion Engineering of Silicon Nitride Microresonators via Reconstructable SU-8 Polymer Cladding
Wang, S. P., Lee, T. H., Chen, Y. Y. & Wang, P. H., Mar 2022, In: Micromachines. 13, 3, 454.Research output: Contribution to journal › Article › peer-review
Open Access3 Scopus citations -
Low-temperature rough-surface wafer bonding with aluminum nitride ceramics implemented by capillary and oxidation actions
Nien, S. M., Ruan, J. L., Kuo, Y. K. & Lee, B. T. H., 15 Mar 2022, In: Ceramics International. 48, 6, p. 8766-8772 7 p.Research output: Contribution to journal › Article › peer-review
1 Scopus citations -
Fusion bonding of copper and silicon at -70 °C by electrochemistry
Chien, P. Y., Cheng, L., Liu, C. Y., Li, J. E. & Lee, B. T. H., 1 Feb 2021, In: Acta Materialia. 204, 116486.Research output: Contribution to journal › Article › peer-review
2 Scopus citations -
Self-powered, hybrid, multifunctional sensor for a human biomechanical monitoring device
Lu, Y. H., Lo, H. H., Wang, J., Lee, T. H. & Fuh, Y. K., 2 Jan 2021, In: Applied Sciences (Switzerland). 11, 2, p. 1-12 12 p., 519.Research output: Contribution to journal › Article › peer-review
Open Access4 Scopus citations