Projects per year
Personal profile
Research Expertise
Heat exchanger design. Heat pipe technology. Heat transfer enhancement technology
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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Dive into the research topics where Chien-Yuh Yang is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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The 34th International Symposium on Transport Phenomenon, ISTP-34
Yang, C.-Y. (PI)
1/12/23 → 6/11/24
Project: Research
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DEVELOPMENT OF HEAT EXCHANGER WITH TWO-PASS DIVERGING MICROCHANNELS FOR EVAPORATION COOLING SYSTEMS
Sung, K. F., Hsu, C. H. & Yang, C. Y., 2024, In: Journal of Enhanced Heat Transfer. 31, 2, p. 1-19 19 p.Research output: Contribution to journal › Article › peer-review
3 Scopus citations -
Flow boiling heat transfer in a plate heat exchanger with mixed chevron angle plates
Yang, C. Y. & Hsieh, M. T., 2024, In: Journal of Physics: Conference Series. 2766, 1, 012145.Research output: Contribution to journal › Conference article › peer-review
Open Access -
FLOW BOILING HEAT TRANSFER IN MICROCHANNEL HEAT EXCHANGERS WITH MICRO POROUS COATING SURFACE
Sung, K. F., Chang, I. C. & Yang, C. Y., 2024, In: Journal of Enhanced Heat Transfer. 31, 6, p. 89-106 18 p.Research output: Contribution to journal › Article › peer-review
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Heat Transfer Performance of Aluminum-Ammonia Heat Pipe at Low Temperature Under Various Heating/Cooling Conditions
Wang, C. C., Lung, C., Hsieh, M. T. & Yang, C. Y., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 253-254 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
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Flow Boiling Heat Transfer Performance Comparison of Skived Straight and CNC Diverging Microchannels Heat Sinks
Lin, F. C., Liu, C. F., Yang, M. T., Lee, S. W., Hsu, C. H., Sung, K. F. & Yang, C. Y., 2023, 39th Annual Semiconductor Thermal Measurement, Modeling and Management Symposium, SEMI-THERM 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (Annual IEEE Semiconductor Thermal Measurement and Management Symposium; vol. 2023-March).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
1 Scopus citations
Datasets
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Data for: Flow Boiling Heat Transfer and Pressure Drop of Refrigerants HFO-1234yf and HFC-134a in Small Circular Tube
Yang, C.-Y. (Creator), Nalbandian, H. (Contributor) & Lin, F.-C. (Contributor), Mendeley Data, 7 Mar 2018
DOI: 10.17632/xrtf6fc4hd.1, https://data.mendeley.com/datasets/xrtf6fc4hd
Dataset