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Cheng-Yi Liu

Professor

Calculated based on number of publications stored in Pure and citations from Scopus
1996 …2024

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  • 2009

    Cross-interaction effect in the Ni/Sn/Cu solder joints

    Tseng, H. W., Wang, S. J. & Liu, C. Y., 2009, EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference. p. 325-330 6 p. 5416529. (Proceedings of the Electronic Packaging Technology Conference, EPTC).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    1 Scopus citations

  • Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces

    Tseng, H. W., Lu, C. T., Hsiao, Y. H., Liao, P. L., Chuang, Y. C. & Liu, C. Y., 2009, EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference. p. 401-405 5 p. 5416515. (Proceedings of the Electronic Packaging Technology Conference, EPTC).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    2 Scopus citations
  • 2008

    Copper/carbon nanotube composite interconnect for enhanced electromigration resistance

    Chai, Y., Chan, P. C. H., Fu, Y., Chuang, Y. C. & Liu, C. Y., 2008, 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC. p. 412-420 9 p. 4550004. (Proceedings - Electronic Components and Technology Conference).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    41 Scopus citations
  • 2007

    Studies and issues of thin-GaN LED process

    Chen, P. H., Lin, C. L., Lin, Y. H., Chou, P. K. & Liu, C. Y., 2007, Seventh International Conference on Solid State Lighting. 66690V. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 6669).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • 2006

    Current density dependence of EM (electromigration)-induced flip-chip Cu pad consumption

    Liao, P. L. & Liu, C. Y., 2006, 2006 International Conference on Electronic Materials and Packaging, EMAP. 4430690. (2006 International Conference on Electronic Materials and Packaging, EMAP).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Nanothick layer transfer of hydrogen-implanted wafer using polysilicon sacrificial layer

    Huang, C. H., Chang, C. L., Yang, Y. Y., Suryasindhu, T., Liao, W. C., Su, Y. H., Li, P. W., Liu, C. Y., Lai, C. S., Ting, J. H., Chu, C. S., Lee, C. S. & Lee, T. H., 2006, Nanomanufacturing. Materials Research Society, p. 84-89 6 p. (Materials Research Society Symposium Proceedings; vol. 921).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • Study of interfacial reactions by Ni/Sn5Ag/Cu sandwich structure

    Tseng, H. W. & Liu, C. Y., 2006, 2006 International Conference on Electronic Materials and Packaging, EMAP. 4430691. (2006 International Conference on Electronic Materials and Packaging, EMAP).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • 2005

    Electromigration studies on Sn(Cu) alloy lines

    Lu, C. C., Wang, S. J. & Liu, C. Y., 2005, Proceedings - 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces. p. 54-59 6 p. 1432045. (Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces; vol. 2005).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

  • 2003

    Metallic wafer and chip bonding for LED packaging

    Hsu, C. C., Wang, S. J. & Liu, C. Y., 2003, CLEO/Pacific Rim 2003 - 5th Pacific Rim Conference on Lasers and Electro-Optics: Photonics Lights Innovation, from Nano-Structures and Devices to Systems and Networks, Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 26 1 p. 1274506. (Pacific Rim Conference on Lasers and Electro-Optics, CLEO - Technical Digest; vol. 1).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

    11 Scopus citations
  • 2002

    Spalling suppression by Sn-3.5Ag incorporated with Cu particles

    Liu, C. Y. & Wang, S. J., 2002, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., p. 366-371 6 p. 1188866. (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review