Cheng-Yi Liu - Projects - National Central University

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Emailchengyicc.ncu.edutw
Websitehttp://www.cme.ncu.edu.tw/products_detail/29.htm

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Research activity per year

2 Active
29 Finished

29 results

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Finished

無
Liu, C.-Y. (PI)
1/11/23 → 31/10/24
Project: Research
無
Liu, C.-Y. (PI)
1/10/23 → 30/09/24
Project: Research
無
Liu, C.-Y. (PI)
1/09/23 → 31/08/24
Project: Research
開發製作具三維立體Cu6Sn5及(Cu,Ni)6Sn5化合物支架銲點的錫膏(2/3)
Liu, C.-Y. (PI)
1/08/23 → 31/07/24
Project: Research
無
Liu, C.-Y. (PI)
1/03/23 → 29/02/24
Project: Research
開發製作具三維立體Cu6Sn5及(Cu,Ni)6Sn5化合物支架銲點的錫膏(1/3)
Liu, C.-Y. (PI)
1/08/22 → 31/07/23
Project: Research
無
Liu, C.-Y. (PI)
1/07/22 → 31/12/22
Project: Research
無
Liu, C.-Y. (PI)
1/06/22 → 31/07/23
Project: Research
無
Liu, C.-Y. (PI)
15/03/22 → 15/10/22
Project: Research
無
Liu, C.-Y. (PI)
1/03/22 → 28/02/23
Project: Research
無
Liu, C.-Y. (PI)
1/02/22 → 31/01/23
Project: Research
Improve chemical adhesion between the 2RT (reverse-treatment foil, Rz < 2 μm) and EM526/M6 prepreg by silane
Liu, C.-Y. (PI)
1/02/22 → 31/10/22
Project: Research
High Efficiency and High Freedom Packaging Technique of Tandem Perovskite Solar Cell(3/3)
Liu, C.-Y. (PI)
1/08/21 → 31/10/22
Project: Research
被動元件覆晶封裝之測試
Liu, C.-Y. (PI)
1/05/21 → 31/01/22
Project: Research
微尺寸Sn-Bi自組對位之塗料製作
Liu, C.-Y. (PI)
1/12/20 → 1/12/21
Project: Research
High Efficiency and High Freedom Packaging Technique of Tandem Perovskite Solar Cell(2/3)
Liu, C.-Y. (PI)
1/08/20 → 31/07/21
Project: Research
Electro-Migration Failure Map for Snag/Cu(Ni) Pad Micro-Flip-Chip Solder Joint(3/3)
Liu, C.-Y. (PI)
1/08/20 → 31/07/21
Project: Research
Electro-Migration Failure Map for Snag/Cu(Ni) Pad Micro-Flip-Chip Solder Joint(2/3)
Liu, C.-Y. (PI)
1/08/19 → 31/07/20
Project: Research
High Efficiency and High Freedom Packaging Technique of Tandem Perovskite Solar Cell(1/3)
Liu, C.-Y. (PI)
1/08/19 → 31/07/20
Project: Research
Low Temperature Cu/Pd Diffusion Bonding Development and Applying Cu-Pd Bonding on Thin-Gan Led Packaging Process(3/3)
Liu, C.-Y. (PI)
1/08/18 → 31/07/19
Project: Research
Electro-Migration Failure Map for Snag/Cu(Ni) Pad Micro-Flip-Chip Solder Joint(1/3)
Liu, C.-Y. (PI)
1/08/18 → 31/07/19
Project: Research
Low Temperature Cu/Pd Diffusion Bonding Development and Applying Cu-Pd Bonding on Thin-Gan Led Packaging Process(2/3)
Liu, C.-Y. (PI)
1/08/17 → 31/07/18
Project: Research
Effect of LED Die-Attachment on Stress in GaN Eip-Layers and Anelastic Behavior(3/3)
Liu, C.-Y. (PI)
1/08/17 → 31/07/18
Project: Research
High Energy Saving and Extreme Cri Indoor Lighting( II )
Liu, C.-Y. (PI)
1/01/17 → 31/12/17
Project: Research
Effect of LED Die-Attachment on Stress in GaN Eip-Layers and Anelastic Behavior(2/3)
Liu, C.-Y. (PI)
1/08/16 → 31/07/17
Project: Research
Low Temperature Cu/Pd Diffusion Bonding Development and Applying Cu-Pd Bonding on Thin-Gan Led Packaging Process(1/3)
Liu, C.-Y. (PI)
1/08/16 → 31/07/17
Project: Research
High energy saving and extreme CRI indoor lighting(1/2)
Liu, C.-Y. (PI)
1/01/16 → 31/12/16
Project: Research
Effect of LED Die-Attachment on Stress in GaN Eip-Layers and Anelastic Behavior(1/3)
Liu, C.-Y. (PI)
1/08/15 → 31/07/16
Project: Research
最適化裸晶光形設計搭配螢光粉塗佈結構達成節能高效率白光LED之開發
Liu, C.-Y. (PI)
1/01/15 → 31/12/15
Project: Research