Keyphrases
Electromigration
100%
Cu-Sn
82%
Soldering
58%
Cu6Sn5
50%
Sn-Cu
49%
Solder Joint
43%
Light-emitting Diodes
41%
GaN-based LED
40%
Interfacial Reaction
38%
Ni-P
35%
GaN-based Light-emitting Diodes
34%
Joint Interface
32%
Flip chip
31%
Compound Layer
31%
Annealing
30%
Sn-Cu Solder
30%
Cu Substrate
30%
Epilayer
28%
SnO2
28%
Patterned Sapphire Substrate
27%
P-type
27%
Sapphire Substrate
26%
Wafer Bonding
25%
Ag3Sn
25%
Ni-Sn
24%
Spalling
23%
GaN Surface
22%
High Power
21%
Cu3Sn
20%
SnPb Solder
20%
SnPb
19%
P-GaN
19%
Cu Pad
19%
Si Wafer
19%
AuSn
18%
Sn Solder
18%
Solder Bump
18%
Current Stressing
18%
Sn-Cu-Ni
18%
Interfacial Intermetallic Compound
17%
Microstructure
16%
ZnO Nanorods
16%
Induced Failures
16%
Current Density
16%
Self-forming
15%
Sn-Cu Alloy
15%
Flip Chip Solder Joints
15%
Under Bump Metallization
15%
SnO2 Thin Films
14%
Sn-0.7Cu
14%
Material Science
Surface (Surface Science)
81%
Thin Films
77%
Density
72%
Light-Emitting Diode
64%
Solder Joint
64%
Cathode
49%
Sapphire
46%
Film
34%
Oxide Compound
32%
Anode
30%
Intermetallics
29%
Void Growth
26%
Activation Energy
26%
Aluminum Nitride
25%
Annealing
24%
Alloying
23%
Copper Alloy
23%
ZnO
21%
Indium Tin Oxide
17%
Electrical Resistivity
15%
Shear Strength
13%
Oxidation Reaction
12%
Lead-Free Solder
12%
Carrier Concentration
11%
Grain Size
11%
Nucleation
11%
Waveguide
11%
Thermal Stability
11%
Reflectivity
10%
Wet Etching
10%
X-Ray Photoelectron Spectroscopy
10%
Quantum Well
9%
Grain Boundaries
9%
Epilayers
9%
Phase Composition
9%
Thermal Expansion
9%
Carrier Mobility
8%
Oxygen Vacancy
8%
Photoemission Spectroscopy
8%
Stress Relaxation
8%
Wettability
8%
Carbon Nanotube
8%
Nanorod
8%
Epitaxial Film
8%
Silicon
8%
Doping (Additives)
7%
Microhardness
6%
Strength of Materials
6%
Polysiloxane
6%
Nitride Compound
6%
Engineering
Light-Emitting Diode
72%
Thin Films
52%
Electromigration
48%
Sapphire Substrate
38%
Compound Layer
35%
Wafer Bonding
26%
Alloying
22%
Joint Interface
21%
Eutectics
20%
Reflectance
20%
Nitride
19%
Low-Temperature
19%
Si Wafer
18%
Intermetallics
18%
Barrier Layer
18%
Quantum Well
18%
Light Extraction Efficiency
15%
Metallizations
15%
Driving Force
14%
Joints (Structural Components)
14%
Compound Formation
13%
Retardation
12%
Solder Bump
11%
Si Substrate
11%
Raman Spectra
11%
Sandwich Structures
11%
Forward Voltage
11%
Conductive
11%
Light Extraction
10%
Failure Mode
10%
Waveguide
10%
Ray Photoelectron Spectroscopy
10%
Interconnects
9%
Drying
9%
Shear Strength
9%
Bonding System
8%
Photocurrent
8%
Compressive Stress
8%
Output Power
8%
Bonding Process
8%
Alloy Composition
8%
Nanorod
8%
Cavity Surface
8%
Emitting Laser
8%
Carbon Nanotube
8%
Void Growth
7%
Copper Substrate
7%
Surface Morphology
6%
Phase Composition
6%
Cu Film
6%