Personal profile
Research Expertise
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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SDG 7 Affordable and Clean Energy
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Collaborations and top research areas from the last five years
Projects
- 33 Finished
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Electromigration behavior and failure mechanism of micro-bump applications
Liu, C.-Y. (PI)
1/03/24 → 28/02/25
Project: Research
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Abrasion Tests on Nanotwinned and Graphene-Doped Ag Films Prepared by Cyanide-Free Ag Electroplating
Fu, K. L., Yang, L. H. C., Lo, M. H., Cheng, T. Y., Huang, Y. C., Yu, Z. Y., Hsu, C. E., Lin, K. C., Chiu, C. W., Wu, A. T. & Liu, C. Y., 2025, In: Tribology Transactions. 68, 6, p. 1367-1375 9 p.Research output: Contribution to journal › Article › peer-review
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Analysis of leaching chemicals from solder mask and effect on electroless Ni(P) plating
Yu, Z. Y., Wu, C. Y., Fu, K. L., Chang, J. S., Yen, T. H., Tsai, C. P., Hsu, Y. H., Lee, Y. F. & Liu, C. Y., Jan 2025, In: Journal of Materials Science: Materials in Electronics. 36, 1, 84.Research output: Contribution to journal › Article › peer-review
1 Scopus citations -
EM-Induced Voiding Mechanism in Trapped Sn Phase Inside Massive Cu–Sn Compound
Chen, P. Y., Tsai, C. P., Yang, L. H. C., Lin, K. C., Chiu, C. W., Hsu, C. E., Chiu, C. Y., Chang, J. S., Chiu, C. N., Chu, D. T., Chuang, Y. C. & Liu, C. Y., 2025, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 15, 12, p. 2797-2800 4 p.Research output: Contribution to journal › Article › peer-review
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Fast formation mechanism of Cu6Sn5 compound in Sn/Bi/Cu by atomic diffusion in Bi lattice
Yeh, C. Y. & Liu, C. Y., Apr 2025, In: Materials Today Communications. 45, 112215.Research output: Contribution to journal › Article › peer-review
1 Scopus citations -
Grain boundary motions of low temperature and low pressure copper to copper direct bonding by electroplating ultra-fine-grain (UFG) Cu
Lee, Y. F., Chiu, C. W., Chiu, C. Y., Huang, Y. C., Lo, M. H., Yang, L. H. C., Cheng, T. Y., Yu, Z. Y., Hsu, C. E., Lin, K. C., Chen, P. Y., Huang, W. C., Chang, J. S., Pan, S. A., Su, Y. C., Lin, C. L., Hsieh, H. C., Lin, C. H. & Liu, C. Y., Dec 2025, In: Scientific Reports. 15, 1, 30978.Research output: Contribution to journal › Article › peer-review
Open Access
Datasets
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Supplementary Material from Low temperature Cu-Cu direct bonding in air ambient by ultrafast surface grain growth
Lee, Y.-F. (Creator), Huang, Y.-C. (Creator), Chang, J.-S. (Creator), Cheng, T.-Y. (Creator), Chen, P.-Y. (Creator), Huang, W.-C. (Creator), Lo, M.-H. (Creator), Fu, K.-L. (Creator), Lai, T.-L. (Creator), Chang, P.-K. (Creator), Yu, Z.-Y. (Creator) & Liu, C.-Y. (Creator), The Royal Society, 2024
DOI: 10.6084/m9.figshare.26956246.v1, https://rs.figshare.com/articles/dataset/Supplementary_Material_from_Low_temperature_Cu-Cu_direct_bonding_in_air_ambient_by_ultrafast_surface_grain_growth/26956246/1
Dataset
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Supplementary Material from Low temperature Cu-Cu direct bonding in air ambient by ultrafast surface grain growth
Lee, Y.-F. (Creator), Huang, Y.-C. (Creator), Chang, J.-S. (Creator), Cheng, T.-Y. (Creator), Chen, P.-Y. (Creator), Huang, W.-C. (Creator), Lo, M.-H. (Creator), Fu, K.-L. (Creator), Lai, T.-L. (Creator), Chang, P.-K. (Creator), Yu, Z.-Y. (Creator) & Liu, C.-Y. (Creator), The Royal Society, 2024
DOI: 10.6084/m9.figshare.26956246, https://rs.figshare.com/articles/dataset/Supplementary_Material_from_Low_temperature_Cu-Cu_direct_bonding_in_air_ambient_by_ultrafast_surface_grain_growth/26956246
Dataset