Projects per year
Personal profile
Research Expertise
Light-emitting diodes, wafer bonding technology, wireless broadband flip chip packaging technology, electromigration thermal migration research
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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Dive into the research topics where Cheng-Yi Liu is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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Electromigration behavior and failure mechanism of micro-bump applications
Liu, C.-Y. (PI)
1/03/24 → 28/02/25
Project: Research
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Analysis of leaching chemicals from solder mask and effect on electroless Ni(P) plating
Yu, Z. Y., Wu, C. Y., Fu, K. L., Chang, J. S., Yen, T. H., Tsai, C. P., Hsu, Y. H., Lee, Y. F. & Liu, C. Y., Jan 2025, In: Journal of Materials Science: Materials in Electronics. 36, 1, 84.Research output: Contribution to journal › Article › peer-review
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Abnormal Cu Grain Growth by External Stress on Electroplated Cu Films
Chang, J. S., Chiu, C. Y., Huang, Y. C., Cheng, T. Y., Yu, Z. Y., Lo, M. H. & Liu, C. Y., Jun 2024, In: JOM. 76, 6, p. 2711-2717 7 p.Research output: Contribution to journal › Article › peer-review
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Crystalline Orientation Effect of Single-Grain Sn-Rich Cu Pillar Bumps on Electromigration Lifetime
Huang, Y. C., Tsai, C. P., Chiu, C. Y., Huang, W. C., Lo, M. H., Liu, C. Y., Chang, J. S., Chiu, C. N. & Chuang, Y. C., 2024, In: IEEE Transactions on Electron Devices. 71, 9, p. 5784-5787 4 p.Research output: Contribution to journal › Article › peer-review
1 Scopus citations -
Effect of expelling P content on Ni(P) dissolution and reaction with SnAgCu(Ni)
Hsu, Y. H., Lo, M. H., Lee, Y. C., Huang, W. C., Chang, J. S., Wang, Y. P. & Liu, C. Y., Apr 2024, In: Journal of Materials Science: Materials in Electronics. 35, 10, 678.Research output: Contribution to journal › Article › peer-review
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High transparent and conductive ZnO/Ag/ZnO film structure
Li, B. J., Chen, W. H., Huang, C. K., Chou, C. Y., Lai, T. L., Fu, K. L. & Liu, C. Y., Jun 2024, In: Materials Today Communications. 39, 109201.Research output: Contribution to journal › Review article › peer-review
1 Scopus citations
Datasets
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Supplementary Material from Low temperature Cu-Cu direct bonding in air ambient by ultrafast surface grain growth
Lee, Y.-F. (Creator), Huang, Y.-C. (Creator), Chang, J.-S. (Creator), Cheng, T.-Y. (Creator), Chen, P.-Y. (Creator), Huang, W.-C. (Creator), Lo, M.-H. (Creator), Fu, K.-L. (Creator), Lai, T.-L. (Creator), Chang, P.-K. (Creator), Yu, Z.-Y. (Creator) & Liu, C.-Y. (Creator), The Royal Society, 2024
DOI: 10.6084/m9.figshare.26956246, https://rs.figshare.com/articles/dataset/Supplementary_Material_from_Low_temperature_Cu-Cu_direct_bonding_in_air_ambient_by_ultrafast_surface_grain_growth/26956246
Dataset
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Supplementary Material from Low temperature Cu-Cu direct bonding in air ambient by ultrafast surface grain growth
Lee, Y.-F. (Creator), Huang, Y.-C. (Creator), Chang, J.-S. (Creator), Cheng, T.-Y. (Creator), Chen, P.-Y. (Creator), Huang, W.-C. (Creator), Lo, M.-H. (Creator), Fu, K.-L. (Creator), Lai, T.-L. (Creator), Chang, P.-K. (Creator), Yu, Z.-Y. (Creator) & Liu, C.-Y. (Creator), The Royal Society, 2024
DOI: 10.6084/m9.figshare.26956246.v1, https://rs.figshare.com/articles/dataset/Supplementary_Material_from_Low_temperature_Cu-Cu_direct_bonding_in_air_ambient_by_ultrafast_surface_grain_growth/26956246/1
Dataset