Projects per year
Personal profile
Research Expertise
Light-emitting diodes, wafer bonding technology, wireless broadband flip chip packaging technology, electromigration thermal migration research
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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Abnormal Cu Grain Growth by External Stress on Electroplated Cu Films
Chang, J. S., Chiu, C. Y., Huang, Y. C., Cheng, T. Y., Yu, Z. Y., Lo, M. H. & Liu, C. Y., Jun 2024, In: JOM. 76, 6, p. 2711-2717 7 p.Research output: Contribution to journal › Article › peer-review
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Effect of expelling P content on Ni(P) dissolution and reaction with SnAgCu(Ni)
Hsu, Y. H., Lo, M. H., Lee, Y. C., Huang, W. C., Chang, J. S., Wang, Y. P. & Liu, C. Y., Apr 2024, In: Journal of Materials Science: Materials in Electronics. 35, 10, 678.Research output: Contribution to journal › Article › peer-review
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High transparent and conductive ZnO/Ag/ZnO film structure
Li, B. J., Chen, W. H., Huang, C. K., Chou, C. Y., Lai, T. L., Fu, K. L. & Liu, C. Y., Jun 2024, In: Materials Today Communications. 39, 109201.Research output: Contribution to journal › Review article › peer-review
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Single-grain Sn-rich micro-bump by reducing Sn undercooling with heterogeneous nucleation
Tsai, C. P., Chiu, C. Y., Huang, W. C., Liu, C. Y., Chang, J. S., Chiu, C. N. & Chuang, Y. C., 15 Feb 2024, In: Materials Letters. 357, 135729.Research output: Contribution to journal › Article › peer-review
2 Scopus citations -
Stacking Fault and Plastic Deformation Mechanism in Nano-twinned Cu Pillar under Ultrahigh Stress
Fu, K. L., Lee, Y. F., Chang, J. S., Lee, C. H., Chen, P. Y., Huang, W. C., Lo, M. H., Huang, Y. C. & Liu, C. Y., Nov 2024, In: Advanced Engineering Materials. 26, 21, 2400990.Research output: Contribution to journal › Article › peer-review
Datasets
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Supplementary Material from Low temperature Cu-Cu direct bonding in air ambient by ultrafast surface grain growth
Lee, Y.-F. (Creator), Huang, Y.-C. (Creator), Chang, J.-S. (Creator), Cheng, T.-Y. (Creator), Chen, P.-Y. (Creator), Huang, W.-C. (Creator), Lo, M.-H. (Creator), Fu, K.-L. (Creator), Lai, T.-L. (Creator), Chang, P.-K. (Creator), Yu, Z.-Y. (Creator) & Liu, C.-Y. (Creator), The Royal Society, 2024
DOI: 10.6084/m9.figshare.26956246, https://rs.figshare.com/articles/dataset/Supplementary_Material_from_Low_temperature_Cu-Cu_direct_bonding_in_air_ambient_by_ultrafast_surface_grain_growth/26956246
Dataset
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Supplementary Material from Low temperature Cu-Cu direct bonding in air ambient by ultrafast surface grain growth
Lee, Y.-F. (Creator), Huang, Y.-C. (Creator), Chang, J.-S. (Creator), Cheng, T.-Y. (Creator), Chen, P.-Y. (Creator), Huang, W.-C. (Creator), Lo, M.-H. (Creator), Fu, K.-L. (Creator), Lai, T.-L. (Creator), Chang, P.-K. (Creator), Yu, Z.-Y. (Creator) & Liu, C.-Y. (Creator), The Royal Society, 2024
DOI: 10.6084/m9.figshare.26956246.v1, https://rs.figshare.com/articles/dataset/Supplementary_Material_from_Low_temperature_Cu-Cu_direct_bonding_in_air_ambient_by_ultrafast_surface_grain_growth/26956246/1
Dataset