Projects per year
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低維度材料之關鍵技術整合於建構前瞻半導體元件之研究-低維度材料之關鍵技術整合於建構前瞻半導體元件之研究(2/3)
Su, C.-Y. (PI)
1/05/24 → 30/04/25
Project: Research
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Electromigration behavior and failure mechanism of micro-bump applications
Liu, C.-Y. (PI)
1/03/24 → 28/02/25
Project: Research
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High Operating Temperature Cooled Infrared Image Sensing Technology(1/3)
Chyi, J.-I. (PI)
1/01/24 → 31/12/24
Project: Research
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WIN-NCU Compound Semiconductors Research Center (2/3)
Chyi, J.-I. (PI)
1/11/23 → 31/10/24
Project: Research
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結構波之產生及操控技術與前瞻通訊應用-用於下世代無線網路的光無線與光子-毫米波收發模組之開發(子計畫二)
Shi, J.-W. (PI)
1/08/23 → 31/07/24
Project: Research
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低維度材料之關鍵技術整合於建構前瞻半導體元件之研究-低維度材料之關鍵技術整合於建構前瞻半導體元件之研究(1/3)
Su, C.-Y. (PI)
1/05/23 → 30/04/24
Project: Research
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WIN-NCU Compound Semiconductors Research Center (1/3)
Chyi, J.-I. (PI)
1/11/22 → 31/10/23
Project: Research
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低維度新穎材料、晶圓級製程與關鍵技術整合於建構前瞻半導體元件之研究-低維度新穎材料、晶圓級製程與關鍵技術整合於建構前瞻半導體元件之研究(2/2)
Su, C.-Y. (PI)
1/05/22 → 31/07/23
Project: Research
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Improve chemical adhesion between the 2RT (reverse-treatment foil, Rz < 2 μm) and EM526/M6 prepreg by silane
Liu, C.-Y. (PI)
1/02/22 → 31/10/22
Project: Research
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Development of multi-functional spectroscopic reflective ellipsometry technology
Li, M.-C. (PI)
1/01/22 → 28/02/23
Project: Research
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"Naked-Eyes 3d Vedio without Display" Implemented by Volume Holographic Optical Element(3/3)
Yu, Y.-W. (PI)
1/08/21 → 31/10/22
Project: Research
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Study of 50-M Solid-State Spot Light for High-Standard Stage Projection System(2/2)
Sun, C.-C. (PI)
1/08/21 → 31/10/22
Project: Research
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High Efficiency and High Freedom Packaging Technique of Tandem Perovskite Solar Cell(3/3)
Liu, C.-Y. (PI)
1/08/21 → 31/10/22
Project: Research
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Sub-Project One : Study of Simulation Model for Strong Volume Hologram with Complex Wavefront(3/3)
Sun, C.-C. (PI)
1/08/21 → 31/10/22
Project: Research
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